Modular parametric finite element modelling for reliability-studies in electronic and MEMS packaging

Author

Wunderle, Bernhard ; Auersperg, Jürgen ; Grosser, Volker ; Kaulfersch, Eberhard ; Wittler, Olaf ; Michel, Bernd

Author_Institution

Fraunhofer Inst. Zuverlassigkeit und Mikrointegration, Berlin, Germany

fYear

2003

fDate

5-7 May 2003

Firstpage

335

Lastpage

340

Abstract

A modular and parametric approach to FE-modelling is presented which allows rapid virtual prototyping for MEMS and other microelectronics packages with respect to some topical reliability issues: Thermal management and thermo-mechanical fatigue. Thereby the method of automatic model generation by modular parametric modelling is outlined and some examples featuring the required solution techniques are given. This simulation procedure forms part of a comprehensive design optimisation process in the field of predictive engineering.

Keywords

fatigue; finite element analysis; integrated circuit packaging; integrated circuit reliability; micromechanical devices; thermal management (packaging); MEMS packaging; MEMS reliability; automatic model generation; comprehensive design optimisation process; electronic packaging; microelectronics packages; modular parametric finite element modelling; predictive engineering; rapid virtual prototyping; thermal management; thermomechanical fatigue; Electronic packaging thermal management; Electronics packaging; Fatigue; Finite element methods; Microelectronics; Micromechanical devices; Rapid thermal processing; Thermal management; Thermomechanical processes; Virtual prototyping;

fLanguage

English

Publisher

ieee

Conference_Titel

Design, Test, Integration and Packaging of MEMS/MOEMS 2003. Symposium on

Print_ISBN

0-7803-7066-X

Type

conf

DOI

10.1109/DTIP.2003.1287063

Filename

1287063