• DocumentCode
    408447
  • Title

    Implementation of artificial neural networks on on-chip interconnects in VLSI circuits

  • Author

    Kumar, N. Suresh ; Kumar, M. Prem ; Anandh, T. Vijay ; Raju, Mrs S. ; Kumar, V. Abhai

  • Author_Institution
    Dept. of ECE, Mepco Schlenk Eng. Coll., Sivakasi, India
  • fYear
    2003
  • fDate
    18-19 Dec. 2003
  • Firstpage
    59
  • Lastpage
    64
  • Abstract
    The advent of the VLSI circuits has brought down the size of the semiconductor devices considerably. As the size decreases the effects of reduced chip dimensions dominates the performance of the circuits. Consequently, the interconnection and packaging related issues are among the main factors that determine the number of circuits that can be integrated on a chip as well as the chip performance. The wiring capacitance and impedance, transmission line phenomenon, cross-talk between wires, simultaneous switching noise and clock skew are the factors that affect the performance of the circuits. The objective of this paper is to optimize on-chip interconnects for crosstalk and propagation delay using artificial neural networks.
  • Keywords
    VLSI; finite difference methods; integrated circuit interconnections; integrated circuit packaging; neural nets; VLSI circuits; artificial neural networks; chip dimensions; chip performance; clock skew; cross-talk; on-chip interconnects; packaging; propagation delay; semiconductor devices; simultaneous switching noise; transmission line phenomenon; wiring capacitance; Artificial neural networks; Capacitance; Crosstalk; Impedance; Integrated circuit interconnections; Network-on-a-chip; Semiconductor device packaging; Semiconductor devices; Very large scale integration; Wiring;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electromagnetic Interference and Compatibility, 2003. INCEMIC 2003. 8th International Conference on
  • Print_ISBN
    81-900652-1-1
  • Type

    conf

  • DOI
    10.1109/ICEMIC.2003.1287760
  • Filename
    1287760