• DocumentCode
    409508
  • Title

    Analysis and experimental verification of thermal drift in a constant temperature control type three-axis accelerometer for high temperatures with a novel composition of Wheatstone bridge

  • Author

    Lee, Kyung II ; Takao, Hidekuni ; Sawada, Kazuaki ; Ishida, Makoto

  • Author_Institution
    Dept. of Electr. & Electron. Eng., Toyohashi Univ. of Technol., Japan
  • fYear
    2004
  • fDate
    2004
  • Firstpage
    241
  • Lastpage
    244
  • Abstract
    In this study, a suppression method of generated distortion on the beam structures due to thermal stress is investigated for much reduction of thermal drift. Moreover, a novel composition of Wheatstone bridge for acceleration detection is presented to reduce thermal drift more. Thermal drift analysis, and design optimization to minimize the thermal drift of sensitivity and offset voltage is performed with FEM analysis. Experimental results agreed well with these theoretical results. When the temperature of newly fabricated device base on thermal drift analysis is controlled at 300°C with temperature control system, an offset voltage drift increased a little as compared to offset voltage drift when temperature is not controlled. And, Temperature Coefficient of Sensitivity (TCS) of the device is much reduced from original TCS of -1966 ppm/°C to -126 ppm/°C without any characteristic compensation.
  • Keywords
    accelerometers; finite element analysis; microsensors; temperature control; temperature sensors; thermal stresses; 300 degC; FEM analysis; Wheatstone bridge; acceleration detection; beam structures; finite element method; offset voltage; optimization; sensitivity; temperature coefficient; temperature control; thermal drift; thermal stress; three axis accelerometer; Acceleration; Accelerometers; Bridge circuits; Control systems; Design optimization; Performance analysis; Temperature control; Temperature sensors; Thermal stresses; Voltage control;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Micro Electro Mechanical Systems, 2004. 17th IEEE International Conference on. (MEMS)
  • Print_ISBN
    0-7803-8265-X
  • Type

    conf

  • DOI
    10.1109/MEMS.2004.1290567
  • Filename
    1290567