Fabrication and characterization of a pixel level micro vacuum package for infrared imager

In this paper, we propose a one-chip image sensor capable of simultaneously taking pictures of an infrared image and a visible image, and fabricate and evaluate a micro vacuum package necessary to realize such an image sensor. This micro vacuum package is of a pixel level size, hermetically seals an infrared detector (bolometer) and thermally insulates the same from the environment. This paper shows that, by using a silicon sputtering method for vacuum sealing, the inside can be maintained at a high degree of vacuum, and that a heat insulation property necessary for an infrared sensor can be obtained.