Six-pack IGBT dynamic electro-thermal model: parameter extraction and validation

Author

Reichl, J. ; Berning, D. ; Hefner, A. ; Lai, J.-S.

Author_Institution

Future Energy Electron. Center, Virginia Polytech. Inst. & State Univ., Blacksburg, VA, USA

Volume

1

fYear

2004

fDate

2004

Firstpage

246

Abstract

An electro-thermal simulation model is developed for a six-pack IGBT power module. A measurement system suitable for extracting transient thermal data for short term, high-power heating conditions is used in this work for thermal model validation. A set of parameter extraction software tools is used to extract the electrical parameters as well as temperature dependent parameters associated with the IGBT die within the module.

Keywords

electronic engineering computing; insulated gate bipolar transistors; multichip modules; direct-bond copper; electrical parameters; electro-thermal simulation model; high-power heating condition; insulated gate bipolar transistors; parameter extraction software tools; six-pack IGBT; temperature dependant parameters; thermal network; transient thermal data; Area measurement; Bridges; Data mining; Insulated gate bipolar transistors; NIST; Parameter extraction; Power system modeling; Semiconductor device measurement; Silicon; Temperature dependence;

fLanguage

English

Publisher

ieee

Conference_Titel

Applied Power Electronics Conference and Exposition, 2004. APEC '04. Nineteenth Annual IEEE

Print_ISBN

0-7803-8269-2

Type

conf

DOI

10.1109/APEC.2004.1295817

Filename

1295817