DocumentCode
412180
Title
Investigation of three-dimensional imaging of a silicon flip-chip using two-photon optical beam induced current microscopy
Author
Ramsa, E. ; Ried, D.T. ; Wilsher, K.
Author_Institution
Ultrafast Opt. Group, Heriot-Watt Univ., Edinburgh, UK
fYear
2003
fDate
6-6 June 2003
Abstract
We describe an effective means for acquiring three-dimensional profiles of integrated circuits using the sensitive focal dependence of the two-photon optical beam induced current (TOBIC) effect. Our experimental system was based around an inverted microscope design.
Keywords
elemental semiconductors; flip-chip devices; monolithic integrated circuits; optical images; optical microscopy; silicon; two-photon processes; Si; TOBIC effect; integrated circuits; inverted microscope design; sensitive focal dependency; silicon flip-chip; three-dimensional imaging; two-photon optical beam induced current microscopy; Biomedical optical imaging; Circuits; High-resolution imaging; Optical beams; Optical imaging; Optical microscopy; Optical sensors; Photoconductivity; Silicon; Ultrafast optics;
fLanguage
English
Publisher
ieee
Conference_Titel
Lasers and Electro-Optics, 2003. CLEO '03. Conference on
Conference_Location
Baltimore, MD, USA
Print_ISBN
1-55752-748-2
Type
conf
Filename
1298330
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