• DocumentCode
    413584
  • Title

    Material properties of Cu(In,Ga)Se/sub 2/ thin films prepared by the reaction of thermally evaporated compound materials in H/sub 2/Se/Ar

  • Author

    Chenene, M.L. ; Alberts, V. ; Cuamba, B.C.

  • Author_Institution
    Dept. of Phys., Eduardo Mondlane Univ., Maputo, Mozambique
  • Volume
    1
  • fYear
    2003
  • fDate
    18-18 May 2003
  • Firstpage
    406
  • Abstract
    In this study, device quality chalcopyrite thin films were prepared by a simple and reproducible two-step growth process. The precursors were deposited by the thermal evaporation of pulverized compound materials from a single crucible onto Mo coated glass substrates at temperatures around 250/spl deg/C. The precursors were subsequently reacted a controlled H/sub 2/Se/Ar atmosphere at temperatures ranging between 350/spl deg/C and 500/spl deg/C. X-ray fluorescence (XRF) studies revealed marginal changes in the overall bulk compositions of the films at the respective reaction temperatures, clearly demonstrating the reproducibility of the growth process. The material quality (i.e., surface morphologies, formation of crystalline phases and in-depth compositional uniformity) of the films was compared at the respective reaction temperatures in order to determine optimum processing parameters.
  • Keywords
    X-ray fluorescence analysis; copper compounds; gallium compounds; indium compounds; semiconductor growth; semiconductor thin films; surface composition; surface morphology; ternary semiconductors; vacuum deposition; 350 to 500 degC; Cu(InGa)Se/sub 2/; Mo coated glass substrate; X-ray fluorescence; crystalline phase; device quality chalcopyrite thin film; in-depth compositional uniformity; material quality; optimum processing parameter; overall bulk composition; pulverized compound material; surface morphology; thermal evaporation; two-step growth process;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Photovoltaic Energy Conversion, 2003. Proceedings of 3rd World Conference on
  • Conference_Location
    Osaka, Japan
  • Print_ISBN
    4-9901816-0-3
  • Type

    conf

  • Filename
    1305306