DocumentCode
414488
Title
The development of dual gate poly scheme with plasma nitrided gate oxide for mobile high performance DRAMs: plasma process monitoring and the correlation with electrical results
Author
Hong, S.H. ; Jeon, T.S. ; Koo, B.Y. ; Hyun, S.J. ; Shin, Y.G. ; Chun, U-In ; Moon, J.T.
Author_Institution
Semicond. R&D Center, Samsung Electron. Co., Ltd., Kyungki-Do, South Korea
fYear
2004
fDate
2004
Firstpage
219
Lastpage
222
Abstract
The in-line plasma process monitoring was successfully performed with non-contact direct measurement (NCDM) tool and its results were well matched with those from devices. Using this monitoring method, we developed a plasma nitrided gate oxide process for mobile DRAMs with low operating voltage. We confirm that plasma nitrided gate oxide can block the boron penetration in DRAMs, which has higher thermal budget than other devices, and that the NCDM tool can be used for checking the degree of plasma nitridation. We assure that the NCDM tool is a time-effective tool for plasma nitridation process development.
Keywords
CMOS memory circuits; DRAM chips; nitridation; plasma materials processing; process monitoring; PMOSFET; boron penetration; dual gate poly scheme; in-line monitoring; low operating voltage; mobile high performance DRAM; noncontact direct measurement; plasma nitrided gate oxide; plasma process monitoring; surface channel; Boron; Doping; MOSFETs; Monitoring; Plasma applications; Plasma devices; Plasma measurements; Plasma properties; Random access memory; Silicon;
fLanguage
English
Publisher
ieee
Conference_Titel
Integrated Circuit Design and Technology, 2004. ICICDT '04. International Conference on
Print_ISBN
0-7803-8528-4
Type
conf
DOI
10.1109/ICICDT.2004.1309948
Filename
1309948
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