• DocumentCode
    41463
  • Title

    Distributive Quasi-Ballistic Drift Diffusion Model Including Effects of Stress and High Driving Field

  • Author

    Kotlyar, Roza ; Rios, Rafael ; Weber, Cory E. ; Linton, Thomas D. ; Armstrong, Mark ; Kuhn, Kelin

  • Author_Institution
    Dept. of Process Technol. Modeling, Intel Corp., Hillsboro, OR, USA
  • Volume
    62
  • Issue
    3
  • fYear
    2015
  • fDate
    Mar-15
  • Firstpage
    743
  • Lastpage
    750
  • Abstract
    This paper presents a simulation study using a novel distributive quasi-ballistic drift diffusion (DD) TCAD model applied to low mobility unstressed and high mobility stressed scaled pMOS devices. The model is implemented in a DD simulator and used to study the gate length dependence of current drives. The new model captures the physically correct potential distribution and gives the correct drive current limit in ballistic devices for both linear current response and current saturation source-drain bias conditions. The diffusive and ballistic transport is connected using a ballistic probability, which relates to the fundamental time scale in the problem-the mean energy relaxation time. The model captures the ballistic velocity degradation from the diffusive limit at linear source-drain biases. It is shown that the DD simulation with the distributive quasi-ballistic model describes the stress ballistic drive gains at high driving field, which are missed by the existing ballistic models.
  • Keywords
    ballistic transport; field effect transistors; semiconductor device models; stress effects; technology CAD (electronics); TCAD model; ballistic velocity degradation; current saturation source-drain bias conditions; distributive quasiballistic drift diffusion model; field-effect transistors; high driving field effects; linear current response; stress effects; Junctions; Logic gates; Mathematical model; Scattering; Semiconductor device modeling; Silicon; Stress; Ballistic physics; TCAD modeling; TCAD modeling.; field-effect transistors; semiconductor device; silicon; stress effect;
  • fLanguage
    English
  • Journal_Title
    Electron Devices, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9383
  • Type

    jour

  • DOI
    10.1109/TED.2015.2392717
  • Filename
    7027185