DocumentCode :
415911
Title :
Investigation of flow and heat transfer of an impinging jet in a cross-flow for cooling of a heated cube
Author :
Rundstrom, D. ; Moshfegh, B.
Author_Institution :
Dept. of Technol. & Build Environ., Univ. of Gavle, Galve, Sweden
fYear :
2004
fDate :
1-4 June 2004
Firstpage :
455
Abstract :
The current trends towards the greater functionality of electronic devices are resulting in a steady increase in the amount of heat dissipated from electronic components. Forced channel flow is frequently used to remove heat at the walls of the channel where a PCB with a few high heat dissipating components is located. The overall cooling strategy thus must not only match the overall power dissipation load, but also address the requirements of the "ho" components. In combating the whole thermal load with forced channel flow, excessive flow rates will be required. The objective of this study is to investigate if targeted cooling systems, i.e. an impinging jet in combination with a low velocity channel flow can improve the thermal performance of the system. The steady-state 3-D model is developed with the Reynolds-Stress-Model (RSM) as turbulence model. The geometrical case is a channel with a heated cube in the middle of the base plate and two inlets, one horizontal channel flow and one vertical impinging jet. The numerical model is validated against experimental data obtained from three well-known cases, two cases with impinging jet on a flat heated plate and one case with a heated cube in a single channel flow. The effects of the jet Re and jet to-cross-flow velocity ratio are investigated. The airflow pattern around the cube and the surface temperature of the cube as well as the mean values and local distributions of the heat transfer coefficient are presented.
Keywords :
channel flow; cooling; flow simulation; jets; printed circuits; temperature distribution; turbulence; PCB; Reynolds stress model; airflow pattern; cooling; cross flow; electronic component; flat heated plate; flow rate; flow transfer; forced channel flow; heat dissipation; heat transfer; heat transfer coefficient; heated cube; impinging jet; jet Re; jet-cross flow velocity ratio; local distribution; numerical model; power dissipation load; printed circuit board; steady state 3D model; surface temperature; temperature distribution; thermal load; thermal performance; turbulence model; Electronic components; Electronics cooling; Heat engines; Heat transfer; Kinetic energy; Power dissipation; Thermal conductivity; Thermal force; Thermal loading; Thermal stresses;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Thermal and Thermomechanical Phenomena in Electronic Systems, 2004. ITHERM '04. The Ninth Intersociety Conference on
Print_ISBN :
0-7803-8357-5
Type :
conf
DOI :
10.1109/ITHERM.2004.1319210
Filename :
1319210
Link To Document :
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