Title :
Thermal evaluation of DC/DC and PFC integrated power electronics modules
Author :
Pang, Ying-Feng ; Scott, Elaine P.
Author_Institution :
Dept. of Mech. Eng., Virginia Polytech. Inst. & State Univ., Blacksburg, VA, USA
Abstract :
This paper presents the thermal evaluations of a direct current/direct current (DC/DC) integrated power electronics module (IPEM) and a power factor correction (PFC) IPEM employing the embedded power technology. Experimental and numerical approaches were used to characterize both IPEMs under forced air convection conditions. Finally, the significance of the planar metallization layer to the heat flow within the IPEM was investigated.
Keywords :
convection; integrated circuit metallisation; integrated circuit modelling; integrated circuit packaging; integrated circuit testing; power MOSFET; power factor correction; power integrated circuits; thermal analysis; DC-DC integrated power electronics modules; direct current-direct current integrated power electronics module; embedded power technology; forced air convection; heat flow; numerical analysis; planar metallization layer; power factor correction; thermal evaluation; Ceramics; Electronic packaging thermal management; Electronics packaging; MOSFET circuits; Metallization; Plastic packaging; Power electronics; Power system modeling; Silicon carbide; Thermal conductivity;
Conference_Titel :
Thermal and Thermomechanical Phenomena in Electronic Systems, 2004. ITHERM '04. The Ninth Intersociety Conference on
Print_ISBN :
0-7803-8357-5
DOI :
10.1109/ITHERM.2004.1319244
