DocumentCode
415934
Title
Professional development courses
Volume
1
fYear
2004
fDate
1-4 June 2004
Keywords
Bonding; Components, packaging, and manufacturing technology; Integrated circuit packaging; Laminates; Manufacturing processes; Material storage; Plastic packaging; Radio frequency; Semiconductor device packaging; Substrates;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 2004. Proceedings. 54th
Print_ISBN
0-7803-8365-6
Type
conf
DOI
10.1109/ECTC.2004.1319304
Filename
1319304
Link To Document