Optical SMT-packaging for highly efficient and reliable fiber optic components including 1300nm VCSELs

In the presented packaging technology for optical SMT-components, a standard non-optical transparent mould compound is used. The optical access is realized by a prepared aperture in the metallic lead frame of the exposed die pad, which also enables at the same time a high precision fixation to the optical fiber. This principle made it possible to realize an optical clear plane or lensed window as submount surface to the inner electro-optical chips for focused light emission from/to the single mode-fiber. In using an overall non-optic transparent mould compound for packaging, the optical path is completely enclosed in a transparent solid state chip environment. The application of an innovative flip-chip and chip-on-chip technology on the base and the consequent use of wafer processes for hybrid assembling and test made it possible to realize an efficient assembling technology of different multichip-configurations of optical passive and active chips in optical-SMT-packages, e.g. "optical-TSSOP10" on a standard TSSOP-production line. The realisation of a rational well adapted SMT-package for a 1300 nm VCSEL-component, as an O-TSSOP10-VCSEL with coupled SMF access, shows the importance of the optical SMT-packaging for fiber optical applications with transmission rates up to 10 Gbit/s.