Ultra compact optical subassembly using integrated laser diode and silicon microlens for low-cost optical component

Author

Shimura, Daisuke ; Uekawa, Masahiro ; Sekikawa, Ryo ; Kotani, Kyoko ; Maeno, Yoshinori ; Sasaki, Hironori ; Takamori, Takeshi

Author_Institution

R&D Center, Oki Electr. Ind. Co. Ltd., Tokyo, Japan

Volume

1

fYear

2004

fDate

1-4 June 2004

Firstpage

219

Abstract

We have succeeded in developing an ultra compact optical subassembly (OSA) that consists of a pre-aligned Si microlens and a laser diode (LD) integrated on a Si V-groove substrate with a footprint less than 1 mm by 1 mm. This OSA is small enough to be mounted on a TO-CAN package such as TO38, making the resulting optical component ultra compact in size and reducing the packaging process cost. A coupling efficiency better than -2.6 dB between the OSA and a single-mode fiber (SMF) has been experimentally confirmed. The experimental results show the OSA´s applicability to metro networks, making the OSA a promising candidate for low-cost and high-performance optical components.

Keywords

elemental semiconductors; integrated optoelectronics; metropolitan area networks; microlenses; modules; optical transmitters; semiconductor device packaging; silicon; 1 mm; OSA; Si; V-groove substrate; integrated laser diode; low-cost optical component; metro networks; optical modules; pre-aligned microlens; silicon microlens; single-mode fiber coupling efficiency; ultra compact optical subassembly; Diode lasers; Integrated optics; Lenses; Microoptics; Optical devices; Optical feedback; Optical receivers; Optical transmitters; Packaging; Silicon;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 2004. Proceedings. 54th

Print_ISBN

0-7803-8365-6

Type

conf

DOI

10.1109/ECTC.2004.1319341

Filename

1319341