DocumentCode
415968
Title
A simplified cross coupling model for multiple balanced transmission lines
Author
Quint, David ; Bois, Karl ; Wang, Yong
Author_Institution
Hewlett-Packard Co., Fort Collins, CO, USA
Volume
1
fYear
2004
fDate
1-4 June 2004
Firstpage
255
Abstract
Modeling of the coupling between transmission lines in the practical sense has been an elusive quarry. Since the favorite tool of signal integrity designers is SPICE, the ultimate goal should be translation of the mathematics of coupled mode analysis into a simple SPICE formulation. This investigation presents a method to simulate the parasitic coupling between transmission lines in structures where complete isolation is impractical. The conventional mathematical analysis of such coupling does not suggest a simple SPICE solution, so a farther analysis of cause-effect and elimination of unimportant terms resulted in a set of models which uses the transmission line capacitance matrix to create a direct input of parameters to a SPICE subcircuit. This SPICE subcircuit is utilized as an attachment to a previously designed lossy transmission line circuit. The resultant circuit models cross coupling originating from any number of culprits affecting one victim. The circuit requires one victim line and one culprit line, where the assumption is made that all culprit lines carry the same signal. The technique is applicable to single ended and differential pair transmission lines. An HSPICE subcircuit was included to illustrate the ultimate form of the model.
Keywords
SPICE; coupled circuits; coupled mode analysis; coupled transmission lines; multiconductor transmission lines; transmission line matrix methods; HSPICE subcircuit; SPICE; coupled mode analysis; cross coupling model; culprit/victim effects; differential pair transmission lines; lossy transmission line circuit; multiple balanced transmission lines; signal integrity; single ended transmission lines; transmission line capacitance matrix; transmission line parasitic coupling; Coupled mode analysis; Couplings; Distributed parameter circuits; Mathematical analysis; Mathematical model; Mathematics; SPICE; Signal design; Transmission line matrix methods; Transmission lines;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 2004. Proceedings. 54th
Print_ISBN
0-7803-8365-6
Type
conf
DOI
10.1109/ECTC.2004.1319347
Filename
1319347
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