Constitutive modeling of moulding compounds [electronic packaging applications]

Author

Jansen, K.M.B. ; Wang, L. ; Yang, D.G. ; van´t Hof, C. ; Ernst, L.J. ; Bressers, H.J.L. ; Zhang, G.Q.

Author_Institution

Delft Univ. of Technol., Netherlands

Volume

1

fYear

2004

fDate

1-4 June 2004

Firstpage

890

Abstract

The virtual prototyping of electronic components requires reliable material models for all constituent materials. One of these materials is the moulding compound. This is an epoxy resin filled with inorganic (silica) particles, carbon black and processing aids. It shows a clear viscoelastic behaviour which is not only temperature but also cure dependent. This paper deals with the thermal and mechanical characterization and modeling of such moulding compounds with a focus on the effects of the degree of cure and the filler concentration.

Keywords

curing; electronics packaging; filled polymers; glass transition; internal stresses; moulding; plastic packaging; thermal expansion; thermal stresses; viscoelasticity; C; SiO₂; carbon black; cure dependent viscoelasticity; electronic component virtual prototyping; electronic packaging processes; filled epoxy resin; filler concentration; glass transition temperature; moulding compound constitutive modeling; residual stresses; silica particles; temperature dependent viscoelasticity; thermal analysis; thermal expansion; thermal stresses; Elasticity; Electronic packaging thermal management; Epoxy resins; Glass; Polymers; Residual stresses; Semiconductor materials; Silicon compounds; Thermal stresses; Viscosity;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 2004. Proceedings. 54th

Print_ISBN

0-7803-8365-6

Type

conf

DOI

10.1109/ECTC.2004.1319442

Filename

1319442