• DocumentCode
    416070
  • Title

    Super broadband lumped models for embedded passives

  • Author

    Chiu, C.T. ; Horng, T.S. ; Ma, H.L. ; Wu, S.-M. ; Hung, C.P.

  • Author_Institution
    Dept. of Electr. Eng., Nat. Sun Yat-Sen Univ., Kaohsiung, Taiwan
  • Volume
    1
  • fYear
    2004
  • fDate
    1-4 June 2004
  • Firstpage
    1104
  • Abstract
    This paper presents novel equivalent lumped circuits to model three-dimensional inductors and capacitors embedded in a multilayer organic or LTCC substrate with extremely large bandwidth. The developed models combine a core circuit, a five-element modified-T section, to include up to half-wavelength long transmission-line effects, and parallel and series feedback resonators to account for non-conductive and common-ground coupling phenomena. It is emphasized that all the circuit elements in such equivalent models can be extracted mathematically from the measured S parameters. In our establishment of an embedded passives library, the modeled S parameters can agree quite well with measured results over the entire measurement frequency range of 20 GHz. The effective modeling bandwidth is estimated at least several times larger than in the conventional PI-section models.
  • Keywords
    S-parameters; capacitors; ceramic packaging; circuit resonance; coupled circuits; equivalent circuits; inductors; lumped parameter networks; transmission line theory; 0 Hz to 20 GHz; 3D embedded capacitors; 3D embedded inductors; LTCC substrate; S parameters; common-ground coupling phenomena; embedded passives; equivalent lumped circuits; five-element modified-T section; half-wavelength long transmission-line effects; multilayer organic substrate; nonconductive coupling phenomena; parallel feedback resonators; series feedback resonators; super broadband lumped models; Bandwidth; Capacitors; Coupling circuits; Feedback circuits; Frequency measurement; Inductors; Mathematical model; Nonhomogeneous media; Scattering parameters; Transmission lines;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference, 2004. Proceedings. 54th
  • Print_ISBN
    0-7803-8365-6
  • Type

    conf

  • DOI
    10.1109/ECTC.2004.1319478
  • Filename
    1319478