DocumentCode :
416270
Title :
Variational delay metrics for interconnect timing analysis
Author :
Agarwal, K. ; Sylvester, D. ; Blaauw, D. ; Liu, F. ; Nassif, S. ; Vrudhula, S.
Author_Institution :
University of Michigan, Ann Arbor
fYear :
2004
fDate :
7-11 July 2004
Firstpage :
381
Lastpage :
384
Abstract :
In this paper we develop an approach to model interconnect delay under process variability for timing analysis and physical design optimization. The technique allows for closed-form computation of interconnect delay probability density functions (PDFs) given variations in relevant process parameters such as linewidth, metal thickness, and dielectric thickness. We express the resistance and capacitance of a line as a linear function of random variables and then use these to compute circuit moments. Finally, these variability-aware moments are used in known closedform delay metrics to compute interconnect delay PDFs. We compare the approach to SPICE based Monte Carlo simulations and report an error in mean and standard deviation of delay of 1% and 4% on average, respectively.
Keywords :
Capacitance; Delay; Design optimization; Dielectrics; Integrated circuit interconnections; Performance analysis; Probability density function; Random variables; SPICE; Timing;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Design Automation Conference, 2004. Proceedings. 41st
Conference_Location :
San Diego, CA, USA
ISSN :
0738-100X
Print_ISBN :
1-51183-828-8
Type :
conf
Filename :
1322508
Link To Document :
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