DocumentCode
41757
Title
Modeling, Design, and Fabrication of High-Inductance Bond Wire Microtransformers With Toroidal Ferrite Core
Author
Macrelli, Enrico ; Romani, Aldo ; Ningning Wang ; Roy, Saibal ; Hayes, Mike ; Paganelli, Rudi Paolo ; Mathuna, Cian O. ; Tartagni, Marco
Author_Institution
Adv. Res. Center on Electron. Syst., Univ. of Bologna, Cesena, Italy
Volume
30
Issue
10
fYear
2015
fDate
Oct. 2015
Firstpage
5724
Lastpage
5737
Abstract
This paper presents the design of miniaturized bond wire transformers assembled with standard IC bonding wires and NiZn and MnZn ferrite toroidal cores. Several prototypes are fabricated on a printed circuit board substrate with various layouts in a 4.95 mm × 4.95 mm area. The devices are modeled by analytical means and characterized with impedance measurements over a wide frequency range. Experimental results on 1:38 device show that the secondary self-inductance increases from 0.3 μH with aircore to 315 μH with ferrite core; the coupling coefficient improves from 0.1 with air-core to 0.9 with ferrite core; the effective turns ratio enhances from 0.5 with air-core to 34 with ferrite core. This approach is cost effective and enables a flexible design of efficient micromagnetics on top of ICs with dc inductance to resistance ratio of 70 μH/Ω and an inductance per unit area of 12.8 μH/mm2 up to 0.3 MHz. The design targets the development of bootstrap circuits for ultralow voltage energy harvesting. In this context, a low-voltage step-up oscillator suitable for thermoelectric generator sources is realized with a commercial IC and the proposed microtransformers. Experimental measurements on a discrete prototype report that the circuit bootstraps from voltages down to 260 mV and outputs a dc voltage of 2 V.
Keywords
bootstrap circuits; energy harvesting; ferrites; thermoelectric conversion; transformer cores; bootstrap circuits; high-inductance bond wire microtransformers; impedance measurements; low-voltage step-up oscillator; printed circuit board substrate; standard IC bonding wires; thermoelectric generator sources; toroidal ferrite core; ultralow voltage energy harvesting; voltage 2 V; Bonding; Circuit faults; Ferrites; Inductors; Magnetic cores; Toroidal magnetic fields; Wires; Bonding processes; converters; energy harvesting (EH); ferrites; magnetic cores; oscillators; permeability; power supply in package (PwrSiP); power supply on chip (PwrSoC); printed circuits; thermoelectric; transformers;
fLanguage
English
Journal_Title
Power Electronics, IEEE Transactions on
Publisher
ieee
ISSN
0885-8993
Type
jour
DOI
10.1109/TPEL.2014.2370814
Filename
6955850
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