DocumentCode
41758
Title
Low Power Wireless Sensor Network for Building Monitoring
Author
Torfs, Tom ; Sterken, Tom ; Brebels, S. ; Santana, J. ; van den Hoven, R. ; Spiering, V. ; Bertsch, N. ; Trapani, D. ; Zonta, D.
Author_Institution
IMEC, Leuven, Belgium
Volume
13
Issue
3
fYear
2013
fDate
Mar-13
Firstpage
909
Lastpage
915
Abstract
A wireless sensor network is proposed for monitoring buildings to assess earthquake damage. The sensor nodes use custom-developed capacitive microelectromechanical systems strain and 3-D acceleration sensors and a low power readout application-specified integrated circuit for a battery life of up to 12 years. The strain sensors are mounted at the base of the building to measure the settlement and plastic hinge activation of the building after an earthquake. They measure periodically or on-demand from the base station. The accelerometers are mounted at every floor of the building to measure the seismic response of the building during an earthquake. They record during an earthquake event using a combination of the local acceleration data and remote triggering from the base station based on the acceleration data from multiple sensors across the building. A low power network architecture was implemented over an 802.15.4 MAC in the 900-MHz band. A custom patch antenna was designed in this frequency band to obtain robust links in real-world conditions. The modules have been validated in a full-scale laboratory setup with simulated earthquakes.
Keywords
buildings (structures); earthquakes; microsensors; monitoring; wireless sensor networks; 3-D acceleration sensors; building monitoring; custom-developed capacitive microelectromechanical systems strain; earthquake damage; low power wireless sensor network; sensor nodes; Accelerometers; Base stations; Buildings; Monitoring; Sensors; Strain; Wireless sensor networks; Microelectromechanical systems (MEMS); remote monitoring; structural health monitoring; wireless sensor networks;
fLanguage
English
Journal_Title
Sensors Journal, IEEE
Publisher
ieee
ISSN
1530-437X
Type
jour
DOI
10.1109/JSEN.2012.2218680
Filename
6301674
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