• DocumentCode
    41767
  • Title

    Arc Discharge Anode Reattachment: Simple Model

  • Author

    Nemchinsky, V.

  • Author_Institution
    Keiser Univ., Fort Lauderdale, FL, USA
  • Volume
    42
  • Issue
    12
  • fYear
    2014
  • fDate
    Dec. 2014
  • Firstpage
    4026
  • Lastpage
    4030
  • Abstract
    Anode attachment of a nontransferred dc arc moves along the anode nozzle. Under the influence of the gas flow, it moves downstream thus elongating the arc. This leads to an increase of the arc voltage. The voltage across the cold layer that separates the arc column and the nozzle increases accordingly. This voltage increase leads to the breakdown of the cold anode layer. After this breakdown, the anode attachment jumps to the new upstream location (reattachment). The phenomenon of reattachment of the anode spot has not been completely understood yet. A simple model of the reattachment is suggested. Based on a suggestion that electron temperature inside the cold layer does not drop as low as the heavy particles´ temperature does, it is assumed that some residue electrical conductivity (on the level of 10-2 Ω-1) exists in this layer. It is shown that the voltage drop across the layer rises in time, leading to a fast developing overheating instability. This creates a electrically conductive column at an upstream location and results in reconnection of the arc to this new anode location. Simple estimations of the amplitude of the voltage oscillations and their frequency correspond to the experimental data.
  • Keywords
    arcs (electric); nozzles; plasma instability; plasma temperature; plasma transport processes; anode nozzle; arc discharge anode reattachment; cold anode layer; electrical conductivity; electrically conductive column; electron temperature; nontransferred dc arc; overheating instability; voltage oscillations; Anodes; Argon; Conductivity; Electric breakdown; Oscillators; Plasma temperature; Anode; arc; breakdown; non-transferred; reattachment; reattachment.;
  • fLanguage
    English
  • Journal_Title
    Plasma Science, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0093-3813
  • Type

    jour

  • DOI
    10.1109/TPS.2014.2366419
  • Filename
    6955851