Title :
Direct Interfacing of Dynamic Average Models of Line-Commutated Rectifier Circuits in Nodal Analysis EMTP-Type Solution
Author :
Chiniforoosh, S. ; Atighechi, H. ; Jatskevich, Juri
Author_Institution :
Dept. of Electr. & Comput. Eng., Univ. of British Columbia, Vancouver, BC, Canada
Abstract :
Dynamic average-value models (AVMs) for AC-DC rectifier circuits are generally formulated in state-space form and hence are straightforward to implement in state-variable-based simulation languages. In the nodal analysis-based approach used in electromagnetic transient (EMTP-type) simulation packages, the development of AVMs requires additional effort to reformulate and interface the models with the external ac and dc networks. This paper proposes a new averaged-circuit model for three-phase line-commutated rectifiers which is directly interfaced with the ac and dc networks, thereby achieving a simultaneous solution of the respective variables in EMTP-type solution. The proposed model is verified against conventionally interfaced model, as well as detailed switching model of the original rectifier circuit. A significant improvement of numerical accuracy and stability of the solution is demonstrated even at fairly large time steps.
Keywords :
AC-DC power convertors; EMTP; rectifying circuits; state-space methods; switching convertors; AC-DC rectifier circuits; AVM; EMTP-type simulation packages; EMTP-type solution; averaged-circuit model; dynamic average-value models; electromagnetic transient simulation packages; external ac networks; external dc networks; nodal analysis-based approach; state-space form; state-variable-based simulation languages; switching model; three-phase line-commutated rectifiers; Analytical models; Computational modeling; EMTP; Equations; Integrated circuit modeling; Mathematical model; Switches; AC-DC rectifier circuit; average-value modeling; electromagnetic transient programs (EMTP-type) solution; interfacing methods; line-commutated converter;
Journal_Title :
Circuits and Systems I: Regular Papers, IEEE Transactions on
DOI :
10.1109/TCSI.2013.2290830