• DocumentCode
    418219
  • Title

    Powder-based fabrication techniques for single-wall carbon nanotube circuits

  • Author

    Dai, D. ; Ismail, Y. ; Wang, Wei ; Ladak, H.

  • Author_Institution
    Electr. & Comput. Eng., Northwestern Univ., Evaston, IL, USA
  • Volume
    3
  • fYear
    2004
  • fDate
    23-26 May 2004
  • Abstract
    In this paper, powder-based fabrication techniques are proposed, which are essential for the fabrication of single-wall carbon nanotube (SWNT) circuit. As an alternative to the more demanding chemical vapour deposition methods, the powder-based fabrication technique is simple and cost-effective. In this study, five powder-based preparation techniques are proposed and compared. The one using ultra centrifuge and spinner yields a high concentration of SWNTs evenly distributed on the same, ideal for constructing small SWNT circuits. Furthermore, techniques to separate metallic and semiconducting SWNTs are discussed. The proposed preparation and separation techniques are very important since they form the basis for the study of SWNT circuits. The proposed techniques are expected to have a huge impact on the SWNT circuit fabrication and design.
  • Keywords
    carbon nanotubes; materials preparation; nanotechnology; powder technology; SWNT circuit; chemical vapour deposition; metallic SWTN; nanotechnology; powder-based fabrication; preparation technique; semiconducting SWNT; separation technique; single-wall carbon nanotube; CMOS integrated circuits; CMOS technology; Carbon nanotubes; Chemical vapor deposition; Fabrication; Integrated circuit interconnections; MOSFET circuits; Nanotechnology; Semiconductivity; Very large scale integration;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Circuits and Systems, 2004. ISCAS '04. Proceedings of the 2004 International Symposium on
  • Print_ISBN
    0-7803-8251-X
  • Type

    conf

  • DOI
    10.1109/ISCAS.2004.1328843
  • Filename
    1328843