DocumentCode :
418222
Title :
Electro-thermal study of nano-inductors for integrated low power converters
Author :
Salles, Alain ; Estibals, Bruno ; Alonso, Corinne
Author_Institution :
LAAS, CNRS, Toulouse, France
Volume :
3
fYear :
2004
fDate :
23-26 May 2004
Abstract :
This paper presents an approach on electro-thermal simulation problem for integrated inductors´ performances could be improved using sub-micronic dimensions. Indeed, component scale reduction allows higher working frequencies and brings better quality factor. More, higher inductance value can be achieved (around 1μH for this study) with lower surface consumption. Before realization, some information must be collected on the amount of energy this kind of inductor is able to treat and how nanowires fail. After a presentation of theoretical tools adapted to nanoscale simulation, 3D finite elements simulation tool is validated. First results on inductors are presented and commented. Structure modifications proposals are made taking account of electromigration and heat generation along the coil. The goal is to foresee weakness of the inductive structure in order to make them high-reliable components.
Keywords :
Q-factor; circuit simulation; electromigration; finite element analysis; inductors; nanoelectronics; power convertors; thermal analysis; 3D finite elements simulation tool; component scale reduction; electro-thermal simulation; electromigration; heat generation; high-reliable components; inductance value; inductive structure; integrated converters; integrated inductors; low power converters; nanoinductors; nanoscale simulation; nanowires failures; quality factor; structure modifications; sub-micronic dimensions; surface consumption; theoretical tools; Coils; Electromigration; Finite element methods; Frequency; Inductance; Inductors; Nanowires; Proposals; Q factor; Surface treatment;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Circuits and Systems, 2004. ISCAS '04. Proceedings of the 2004 International Symposium on
Print_ISBN :
0-7803-8251-X
Type :
conf
DOI :
10.1109/ISCAS.2004.1328847
Filename :
1328847
Link To Document :
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