A 29 GHz frequency divider in a miniaturized leadless flip-chip plastic package

Author

Engl, M. ; Pressel, K. ; Dangelmaier, J. ; Theuss, H. ; Eisener, B. ; Eurskens, W. ; Knapp, H. ; Simbürger, W. ; Weigel, R.

Author_Institution

Infineon Technol. AG, Munich, Germany

Volume

2

fYear

2004

fDate

6-11 June 2004

Firstpage

477

Abstract

We present a static frequency divider operating up to 29 GHz in a tiny leadless plastic package. This innovative package, which is intended for high volume production at low cost, has an ultra-miniaturized footprint with a standard pad pitch of 0.5 mm and a standard package height of 0.4 mm. To demonstrate the high frequency capabilities of the package we show the performance up to 29 GHz of a frequency divider with a divide ratio of 16. The circuit is manufactured in a standard SiGe BiCMOS technology for volume production (Infineon B7HFC).

Keywords

BiCMOS integrated circuits; Ge-Si alloys; copper; elemental semiconductors; flip-chip devices; flip-flops; frequency dividers; gold alloys; integrated circuit manufacture; integrated circuit packaging; nickel alloys; plastic packaging; 0.4 mm; 0.5 mm; 29 GHz; Cu; Infineon technology; NiAu; SiGe; SiGe BiCMOS technology; flip-flop; frequency divider; leadless flip-chip plastic package; pad pitch; Assembly; Copper; Frequency conversion; Integrated circuit packaging; Integrated circuit technology; Lead; Packaging machines; Plastic packaging; Production; Semiconductor device packaging;

fLanguage

English

Publisher

ieee

Conference_Titel

Microwave Symposium Digest, 2004 IEEE MTT-S International

ISSN

0149-645X

Print_ISBN

0-7803-8331-1

Type

conf

DOI

10.1109/MWSYM.2004.1336016

Filename

1336016