DocumentCode
421016
Title
The N-P-N structure with C60/p-Si heterojunctions
Author
Berdinsky, A.S. ; Fink, D. ; Gridchin, V.A. ; Yoo, Ji Beom
Author_Institution
Dept. of Mater. Eng., Sungkyunkwan Univ., South Korea
fYear
2004
fDate
1-5 July 2004
Firstpage
27
Lastpage
31
Abstract
To form C60/p-Si heterojunction the thin fullerite film can be easily evaporated on the silicon substrate. In the case of two planar terminals on the fullerite film, there is an asymmetry in conductivities of thin fullerite layer in lateral, σL, and transverse, σT, directions of current flow, σL≪σT. This reason leads to path of the main current flow through one p-n heterojunction into the underlying silicon layer to the other p-n heterojunction, since the lateral component, IL, of current through the fullerite film still much less then transversal component, IT. In this way, a novel family of transistor-like electronic structures has been created. The basic characteristics of these structures named "FOS" (Fullerite on Silicon) are shown and explained simply. Since the lateral conductivity of fullerite film strongly depends on the ambient factors as humidity and chemical environmental, then the creation of sensors are possible. The combination of C60/p-Si heterojunction in n-p-n structure can be useful for the new type of transistors based on fullerite as prospective material for nanoelectronic devices.
Keywords
elemental semiconductors; fullerene devices; fullerenes; gold; heterojunction bipolar transistors; nanoelectronics; semiconductor thin films; silicon; wide band gap semiconductors; Au-C60-Si; C60/p-Si heterojunctions; NPN structure; chemical environmental factors; conductivity asymmetry; current flow direction; fullerite film; fullerite on silicon structure; humidity; nanoelectronic devices; p-n heterojunction; planar terminals; sensors; silicon substrate; transistor-like electronic structures; Fullerenes; Gold; Heterojunction bipolar transistors; Semiconductor films; Silicon;
fLanguage
English
Publisher
ieee
Conference_Titel
Electron Devices and Materials, 2004. Proceedings. 5th Annual. 2004 International Siberian Workshop on
Print_ISBN
5-7782-0463-9
Type
conf
DOI
10.1109/PESC.2004.241012
Filename
1358279
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