DocumentCode :
427421
Title :
A novel decoupling capacitance platform for substrates, sockets, and interposers
Author :
Nickel, Josh G. ; Rosenberger, Joseph F. ; Crane, Stanford W., Jr. ; Horvath, Zsolt ; Jeon, James ; Codd, Patrick T. ; Cangellaris, Andreas C.
Author_Institution :
Silicon Bandwidth, Inc., San Jose, CA, USA
fYear :
2004
fDate :
8-10 Dec. 2004
Firstpage :
231
Lastpage :
234
Abstract :
Due to increasing demands on the power delivery networks within current and next-generation computer systems, power integrity has become a leading focus, in addition to signal integrity, in system design. We will present a technology deployed within substrates, interposers, or sockets to enhance core power delivery. Our technology is comprised of a novel integration of decoupling capacitance between the core power nets and ground. This decoupling replaces the numerous decoupling capacitors suboptimally placed on traditional printed circuit boards (PCBs). The net result it lowered power supply noise and increased core power stability, permitting greater semiconductor switching frequency while reducing overall system cost. Studying actual system applications, we compare this technology to a wide range of expensive and largely ineffective decoupling strategies that have been proposed and even deployed, and demonstrate its superiority in both cost and performance.
Keywords :
capacitance; capacitors; circuit noise; electric connectors; power supply circuits; printed circuit accessories; printed circuits; substrates; computer systems; decoupling capacitance platform; interposers; power delivery networks; power integrity; power stability; power supply noise; printed circuit boards; semiconductor switching frequency; signal integrity; sockets; substrates; system design; Capacitance; Computer networks; Costs; Next generation networking; Noise reduction; Power supplies; Printed circuits; Sockets; Substrates; Switched capacitor circuits;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronics Packaging Technology Conference, 2004. EPTC 2004. Proceedings of 6th
Print_ISBN :
0-7803-8821-6
Type :
conf
DOI :
10.1109/EPTC.2004.1396609
Filename :
1396609
Link To Document :
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