Design for electrical performance of wideband multilayer LTCC microstrip-to-stripline transition

Author

Jhuang, Huei-Han ; Huang, Tian-Wei

Author_Institution

Dept. of Electr. Eng., Nat. Taiwan Univ., Taipei, Taiwan

fYear

2004

fDate

8-10 Dec. 2004

Firstpage

506

Lastpage

509

Abstract

A high impedance compensation technique is proposed to improve the wideband performance of the microstrip-to-stripline transition for multilayer LTCC substrate. A section of high impedance transmission line, which induces additional inductance, is added between the transition and 50 Ω transmission line to compensate the capacitance of the transition. In the paper, various lengths and widths of the high impedance transmission line are simulated by HFSS and compared to optimize the electrical performance which achieves a return loss better than 17 dB over a band from DC to 70 GHz.

Keywords

ceramic packaging; microstrip transitions; transmission lines; 0 to 70 GHz; 50 ohm; HFSS simulation; LTCC substrate; capacitance; electrical performance design; high impedance transmission line; impedance compensation; inductance; microstrip-to-stripline transition; wideband multilayer LTCC; wideband performance; Ceramics; Coplanar transmission lines; Distributed parameter circuits; Impedance; Microstrip; Nonhomogeneous media; Permittivity; Stripline; Transmission lines; Wideband;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Packaging Technology Conference, 2004. EPTC 2004. Proceedings of 6th

Print_ISBN

0-7803-8821-6

Type

conf

DOI

10.1109/EPTC.2004.1396661

Filename

1396661