A study on the mechanical behavior of the sputtered nickel thin films for UBM applications

Author

Sekhar, V.N. ; Srinivasarao, V. ; Jayaganthan, R. ; Mohankumar, K. ; Tay, A.A.O.

Author_Institution

Nano-Microsystems Integration Lab., Singapore Nat. Univ., Singapore

fYear

2004

fDate

8-10 Dec. 2004

Firstpage

610

Lastpage

614

Abstract

Nickel films of different thicknesses of 0.5 and 0.8 μm were deposited by DC magnetron sputtering on the adhesion promoting Ta layer deposited on the silicon (100) wafer. The sputtering conditions used were 4 × 10^-6 base pressure; 3 × 10^-1 working pressure; 4 kW sputter power for 8 inch targets. The films were annealed in vacuum at temperature 200°C and their elastic modulus and hardness were measured by nanoindentation technique (hysitron triboscope). Different load rates were used when indenting the samples. The influence of thickness and annealing temperature on the mechanical behaviour of nickel thin films is explored in the present work.

Keywords

annealing; elastic moduli measurement; hardness; indentation; nanotechnology; nickel; silicon; sputter deposition; thin films; 0.5 micron; 0.8 micron; 200 C; 4 kW; DC magnetron sputtering deposition; Ni; Si; UBM applications; adhesion promoting Ta layer; annealing temperature; elastic modulus measurement; film annealing; film thickness; hardness measurement; hysitron triboscope; mechanical behavior; nanoindentation technique; silicon 100 wafer; sputtered nickel thin films; Annealing; Grain size; Mechanical factors; Metallization; Nickel; Plastic films; Sputtering; Stress; Testing; Transistors;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Packaging Technology Conference, 2004. EPTC 2004. Proceedings of 6th

Print_ISBN

0-7803-8821-6

Type

conf

DOI

10.1109/EPTC.2004.1396680

Filename

1396680