• DocumentCode
    428502
  • Title

    Reconstructing the 3D solder paste surface model using image processing and artificial neural network

  • Author

    Yang, Fang-Chung ; Chung-Hsien Kuo ; Wing, Jein-Jong ; Yang, Ching-Kun

  • Author_Institution
    Dept. of Mech. Eng., Chang-Gung Univ., Taoyuan, Taiwan
  • Volume
    3
  • fYear
    2004
  • fDate
    10-13 Oct. 2004
  • Firstpage
    3051
  • Abstract
    In general, the laser inspection can measure accurate 3D solder paste surface model, however, it is not practical due to the high cost and low inspection speed. This paper presents the three-dimensional (3D) solder paste surface model reconstruction using the image processing and artificial neural network (ANN), and the proposed approach forms the virtual laser 3D automatic optical inspection (AOI) model. The input nodes of the ANN model consist of the image features that are captured from images of using different light sources. The output nodes are the heights of the corresponding image pixel areas. The training patterns of the proposed ANN model use the laser 3D inspection results. Meanwhile, the in-lab design and the commercial coaxial light sources with the pad and sub-area based learning architecture models are constructed and validated, and the estimated 3D surface model achieves 90% accuracy in average.
  • Keywords
    automatic optical inspection; computer vision; image reconstruction; neural nets; printed circuit manufacture; soldering; surface mount technology; 3D solder paste surface model; artificial neural network; automatic optical inspection model; commercial coaxial light sources; image processing; image reconstruction; laser inspection; machine vision; solder paste inspection; Artificial neural networks; Costs; Image processing; Image reconstruction; Inspection; Laser modes; Light sources; Surface emitting lasers; Surface reconstruction; Velocity measurement;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Systems, Man and Cybernetics, 2004 IEEE International Conference on
  • ISSN
    1062-922X
  • Print_ISBN
    0-7803-8566-7
  • Type

    conf

  • DOI
    10.1109/ICSMC.2004.1400799
  • Filename
    1400799