Title :
3D MEMS circuits integration for RF and millimeter wave communications
Author :
Dubuc, D. ; Grenier, K. ; Do, M.N. ; Busquère, J.P. ; Coustou, A. ; Ducarouge, B. ; Melle, S. ; Mazenq, L. ; Bouchriha, F. ; Pons, P. ; Plana, R.
Author_Institution :
P. Sabatier Univ., Toulouse, France
Abstract :
This paper presents the 3D integration concept of RF and millimeterwave circuits through the use of MEMS technologies. Silicon based Microsystems can then be developed and feature high performances thanks to the evolution of the SiGe and MEMS technologies and high compactness due to a 3D integration.
Keywords :
elemental semiconductors; micromechanical devices; millimetre wave circuits; radiofrequency integrated circuits; silicon compounds; 3D circuit integration; MEMS; RF circuits; RF communications; SiGe; millimeterwave circuits; millimeterwave communications; silicon-based Microsystems; Active inductors; Digital circuits; Germanium silicon alloys; Integrated circuit technology; MIM capacitors; Microelectromechanical devices; Micromechanical devices; Packaging; Radio frequency; Silicon germanium;
Conference_Titel :
Semiconductor Conference, 2004. CAS 2004 Proceedings. 2004 International
Print_ISBN :
0-7803-8499-7
DOI :
10.1109/SMICND.2004.1402820
