DocumentCode
429447
Title
Development of a MEMS microsystem to study the effect of mechanical tension on cerebral cortex neurogenesis
Author
Lin, Gisela ; Wu, Vincent I. ; Hainley, Ryan E. ; Flanagan, Lisa A. ; Monuki, Edwin S. ; Tang, William C.
Author_Institution
Dept. of Biomed. Eng., California Univ., Irvine, CA, USA
Volume
1
fYear
2004
fDate
1-5 Sept. 2004
Firstpage
2607
Lastpage
2610
Abstract
A clamp-and-ratchet microstructure based on poly crystalline silicon (polysilicon) microelectromechanical systems (MEMS) technology has been designed to exert mechanical tension along radial glial processes between groups of neural stem cells to study the effect of tension on cerebral cortex neurogenesis. FEA analysis shows that the design should not fail under expected loading conditions. Preliminary studies show that embryonic brain tissue survives under tension for at least six days. Neurospheres have been successfully cultured on Poly(dimethylsiloxane) (PDMS) for eight days and exhibit radial extensions which appear to support neuronal migration. Stretching the PDMS using the clamp and ratchet will produce tension in these radial extensions which may modulate neuronal migration, a key process in cerebral cortex development.
Keywords
biomechanics; brain; cellular biophysics; finite element analysis; micromechanical devices; neurophysiology; FEA; MEMS microsystem; MEMS technology; cerebral cortex neurogenesis; clamp-and-ratchet microstructure; embryonic brain tissue; mechanical tension effect; microelectromechanical system; micromechanics; neural stem cells; neuronal migration; neurospheres; poly crystalline silicon; polydimethylsiloxane; polysilicon; radial glial process; Brain; Cerebral cortex; Crystal microstructure; Crystallization; Embryo; Failure analysis; Microelectromechanical systems; Micromechanical devices; Silicon; Stem cells; MEMS; cerebral cortex; micromechanics; neural stem cell; neurogenesis;
fLanguage
English
Publisher
ieee
Conference_Titel
Engineering in Medicine and Biology Society, 2004. IEMBS '04. 26th Annual International Conference of the IEEE
Conference_Location
San Francisco, CA
Print_ISBN
0-7803-8439-3
Type
conf
DOI
10.1109/IEMBS.2004.1403749
Filename
1403749
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