DocumentCode
430235
Title
TED thermo electrical designer: a new physical design verification tool
Author
Sokolowska, E. ; Barszcz, M. ; Kaminska, B.
fYear
2005
fDate
21-23 March 2005
Firstpage
164
Lastpage
168
Abstract
Although several types of design verification tools have recently been added to the IC design flow, adequate tools for thermal analysis during the design process do not exist. In the absence of thermal analysis, not only can excessive hot spots affect reliability, but important differences between expected and actual performances may compromise circuit functionality. We have introduced a new physical design verification tool, TED, integrating thermal analysis into the design flow. Starting from the extracted view, this tool automatically verifies for each device its temperature and power density, and checks whether maximum ratings are not exceeded. It yields a circuit simulation accounting for realistic temperature distributions without modifying device models.
Keywords
circuit simulation; design engineering; integrated circuit design; temperature distribution; thermal analysis; IC design flow; circuit functionality; circuit simulation; hot spots; physical design verification tool; power density; realistic temperature distribution; reliability; thermal analysis tools; thermo electrical designer; Algorithm design and analysis; Analytical models; Circuit simulation; Computational modeling; Design automation; Equations; Process design; Temperature dependence; Temperature distribution; Thermal conductivity;
fLanguage
English
Publisher
ieee
Conference_Titel
Quality of Electronic Design, 2005. ISQED 2005. Sixth International Symposium on
Print_ISBN
0-7695-2301-3
Type
conf
DOI
10.1109/ISQED.2005.119
Filename
1410577
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