Anisotropic conductive adhesives for millimeter wave flipchip interconnections

In this paper anisotropic conductive pastes (ACP) are proposed for the 1" level interconnect of millimeter- wave multichip modules (MCM) and packages. This I" level interconnect between components on top of the module and the MCM is established in a flipchip approach. Here, instead of gold based bumps ACP together with a structured dielectric layer are used. The latter features additional chip support and hump shaping capabilities. These flipchip arrangements are experimentally investigated and compared to conventional gold based interconnections up to IlOGHz.