DocumentCode
430584
Title
Millimetre-wave MMIC packaging compatible with surface-mount technology (SMT)
Author
Galière, J. ; Valard, J.L. ; Estèbe, E.
Volume
1
fYear
2004
fDate
14-14 Oct. 2004
Firstpage
353
Lastpage
355
Keywords
Assembly; Capacitors; Chip scale packaging; Costs; Integrated circuit interconnections; Lamination; Liquid crystal polymers; MMICs; Substrates; Surface-mount technology;
fLanguage
English
Publisher
ieee
Conference_Titel
Microwave Conference, 2004. 34th European
Conference_Location
Amsterdam, The Netherlands
Print_ISBN
1-58053-992-0
Type
conf
Filename
1412595
Link To Document