DocumentCode

430585

Title

Novel organic SMD package for high-power millimeter wave MMICs

Author

van Heijningen, M. ; Priday, J.

Volume

1

fYear

2004

fDate

14-14 Oct. 2004

Firstpage

357

Lastpage

360

Keywords

Bonding; Circuit simulation; Electromagnetic heating; Insertion loss; MMICs; Packaging; Probes; Radio frequency; Testing; Thermal resistance;

fLanguage

English

Publisher

ieee

Conference_Titel

Microwave Conference, 2004. 34th European

Conference_Location

Amsterdam, The Netherlands

Print_ISBN

1-58053-992-0

Type

conf

Filename

1412597