• DocumentCode
    432285
  • Title

    Minimizing the bulk scattering loss in CRF (DMS) devices

  • Author

    Wang, Weibiao ; Zhang, Xiaodong ; Shui, Yongan ; Wu, Haodong ; De Zhang ; Plessky, Victor P.

  • Author_Institution
    Inst. of Acoust., Nanjing Univ., China
  • Volume
    2
  • fYear
    2004
  • fDate
    23-27 Aug. 2004
  • Firstpage
    1363
  • Abstract
    The losses arising from the scattering of SAW into bulk waves in the non-synchronous areas of SAW devices are studied numerically using the boundary element method combined with finite element method (FEM/BEM). We use a typical one-port hiccup resonator on 42°-LiTaO3 as reference structure. Strong scattering into bulk wave occurs in the central gap due to an abrupt change in periodicity. To reduce the scattering, we replace the gap with electrodes with reduced pitches. We show that it is possible to increase the Q-factor of the resonator significantly while keeping the resonant frequency unchanged. Two types of structures are studied, the "distributed" gap and the "accordion" gap. To minimize the bulk-wave scattering in dual mode SAW filters, we replace the metallized gaps in the traditional filter with distributed gaps. We find an optimal combination of pitch and metallization ratio in the gaps, with insertion loss reduced by 0.3 dB.
  • Keywords
    Q-factor; acoustic wave scattering; finite element analysis; minimisation; surface acoustic wave resonator filters; BEM; FEM; LiTaO3; Q-factor; SAW device nonsynchronous areas; SAW scattering; accordion gap; boundary element method; bulk scattering loss minimization; bulk waves; distributed gap; dual mode SAW filters; finite element method; insertion loss; lithium tantalate substrate; one-port hiccup resonator; resonant frequency; resonator; Boundary element methods; Electrodes; Finite element methods; Metallization; Q factor; Resonant frequency; SAW filters; Scattering; Surface acoustic wave devices; Surface acoustic waves;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Ultrasonics Symposium, 2004 IEEE
  • ISSN
    1051-0117
  • Print_ISBN
    0-7803-8412-1
  • Type

    conf

  • DOI
    10.1109/ULTSYM.2004.1418048
  • Filename
    1418048