DocumentCode
432576
Title
Multi-layer stubs in LTCC technology
Author
Panther, A. ; Stubbs, M.G. ; Kautio, K.
Volume
2
fYear
2004
fDate
12-14 Oct. 2004
Firstpage
617
Lastpage
620
Abstract
Multi-layer structures using multiple conductor layers in LTCC technology are examined for use as microwave stubs. Novel, multi-layer stubs are designed and tested for both microstrip and coplanar systems. Circuit models of multi-layer stubs are presented snd compared with measured data and a bandstop fdter using multi-layer stubs is presented to demonstrate application of the concept.
Keywords
Ceramics; Conductors; Flexible printed circuits; Frequency; Impedance; Microstrip; Microwave circuits; Microwave technology; Packaging; Passive circuits;
fLanguage
English
Publisher
ieee
Conference_Titel
Microwave Conference, 2004. 34th European
Conference_Location
Amsterdam, The Netherlands
Print_ISBN
1-58053-992-0
Type
conf
Filename
1418892
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