DF-RQA practice for SoC [design for reliability and quality assurance]

Author

Marom, Haim

Author_Institution

Freescale Semicond. Israel, Israel

fYear

2004

fDate

18-21 Oct. 2004

Firstpage

162

Lastpage

165

Abstract

A short overview on product development phases and milestones is presented herein. Reliability implications and actions are defined according to the product\´s specific goals and captured in a DF-RQA (design for reliability and quality assurance) document. DF-RQA combines a set of "know how" directives for simulation and proactive measures. This framework is shared, re-used with other new products, and updated per device specific risk assessment. Recent concerns, such as cmos90 leakage impact on burn in, are captured in the DF-RQA template, in addition to traditional reliability elements. The DF-RQA reflects a proactive and practical approach to collaboration required between design engineers and Q&R engineers towards NPI (new product introduction) success.

Keywords

design for manufacture; design for quality; design for testability; integrated circuit design; integrated circuit reliability; leakage currents; product development; quality assurance; risk management; system-on-chip; DF-RQA document; DF-RQA practice; NPI; SoC; burn in leakage effects; design for manufacturability; design for reliability; design for test; new product introduction; proactive collaboration method; proactive measures; product development phases; quality assurance; risk assessment; simulation; Collaboration; Design engineering; Logic circuits; Product development; Production systems; Qualifications; Quality assurance; Reliability engineering; Risk management; System-on-a-chip;

fLanguage

English

Publisher

ieee

Conference_Titel

Integrated Reliability Workshop Final Report, 2004 IEEE International

Print_ISBN

0-7803-8517-9

Type

conf

DOI

10.1109/IRWS.2004.1422764

Filename

1422764