• DocumentCode
    434403
  • Title

    Analysis of shielding effectiveness of enclosure with an aperture using FDTD method

  • Author

    Jiao, Chaoqun ; Li, Lin

  • Author_Institution
    Dept. of Electr. Eng., North China Electr. Power Univ.
  • Volume
    1
  • fYear
    2003
  • fDate
    16-16 May 2003
  • Firstpage
    312
  • Abstract
    The finite difference time-domain (FDTD) method was used to study the nuclear electromagnetic pulse (NEMP) waves and the continuous sinusoidal wave of different frequency coupling into one metallic container through a small aperture in one face of the container. The incident electric fields of NEMP were expressed by double exponential functions with two different decay constants. Based on the algorithm of thin material sheets in the FDTD method, the finite-difference expressions of the electromagnetic components at the common boundary of two thin sheets are dealt with distinguishingly. A method to compute the shielding effectiveness of the metal enclosure with an aperture and thin walls is introduced. The time-domain behavior of the electric field inside the metallic container excited by the waves was obtained by the FDTD method. The results of FDTD and ETL method are compared in order to verify the validity of FDTD modeling
  • Keywords
    electromagnetic compatibility; electromagnetic shielding; finite difference time-domain analysis; modelling; ETL method; FDTD modelling; aperture enclosure; decay constants; double exponential functions; electromagnetic components; finite difference time-domain method; frequency coupling; incident electric fields; metal enclosure; nuclear electromagnetic pulse waves; perfectly matched layer; shielding effectiveness; sinusoidal wave; thin material sheets; Apertures; Containers; EMP radiation effects; Electromagnetic coupling; Electromagnetic shielding; Finite difference methods; Frequency; Sheet materials; Thin wall structures; Time domain analysis;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electromagnetic Compatibility, 2003. EMC '03. 2003 IEEE International Symposium on
  • Conference_Location
    Istanbul
  • Print_ISBN
    0-7803-7779-6
  • Type

    conf

  • DOI
    10.1109/ICSMC2.2003.1428253
  • Filename
    1428253