DocumentCode
435733
Title
SOI CMOS: smaller-size devices, larger-size future
Author
Cristoloveanu, Sorin
Author_Institution
Inst. of Microelectron. Electromagnetism & Photonics, ENSERG, Grenoble, France
Volume
1
fYear
2004
fDate
18-21 Oct. 2004
Firstpage
262
Abstract
Recent measurements and simulation data are presented in order to demonstrate the impact of the miniaturization of SOI MOSFETs. We discuss the role of each critical dimension of the transistor: channel length/width and thickness of silicon film, buried oxide and gate oxide.
Keywords
CMOS integrated circuits; MOSFET; nanotechnology; silicon-on-insulator; SOI CMOS; SOI MOSFET; buried oxide; channel length; channel width; gate oxide; silicon film; transistor critical dimension; CMOS technology; Degradation; Dielectric thin films; Electromagnetic measurements; MOSFETs; Photonics; Positron emission tomography; Semiconductor films; Silicon on insulator technology; Transconductance;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid-State and Integrated Circuits Technology, 2004. Proceedings. 7th International Conference on
Print_ISBN
0-7803-8511-X
Type
conf
DOI
10.1109/ICSICT.2004.1435001
Filename
1435001
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