Single-wafer manufacturing technologies in 300-mm wafer fab

In this paper we describe a new technology implemented with all single-wafer processing in a 300-mm wafer fab. Fully automated manufacturing line is designed to reduce both cycle time and operators. The process has been re-integrated to eliminate all of long-time processes. New cleaning solutions reduce process time drastically and enable us to realize single-wafer wet clean process. Long rinse time is found to cause surface roughness on silicon substrate and degrade device performance. Higher reliability on gate oxide and higher performance of devices are achieved with single-wafer wet clean system. As the results, a very aggressive cycle time has been achieved with high yield and excellent reliability.