DocumentCode
435840
Title
A study on etching profiles of sacrificial layers
Author
Chang-Ju, Wu ; Jin Zhoug-he ; Hui-Lian, Ma ; Yue-Lin, Wang
Author_Institution
Dept. of Inf. Sci. & Electron. Eng., Zhejiang Univ., Hangzhou, China
Volume
3
fYear
2004
fDate
18-21 Oct. 2004
Firstpage
1852
Abstract
Chemical etching of sacrificial layers is a widely used technique in surface micromachining. The causes of the triangle at the etch front are analyzed. The viewpoint that stress is the major factor of the triangle´s formation is put forward. Through a study of the mechanism of the effects of annealing on etch rate, several rules about different annealing conditions having different effects on the etch rate are advanced.
Keywords
annealing; etching; micromachining; annealing; chemical etching; etching profiles; sacrificial layers; surface micromachining; Annealing; Etching; Gravity; Machining; Microchannel; Microscopy; Plasma measurements; Plasma temperature; Stress; Tiles;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid-State and Integrated Circuits Technology, 2004. Proceedings. 7th International Conference on
Print_ISBN
0-7803-8511-X
Type
conf
DOI
10.1109/ICSICT.2004.1435196
Filename
1435196
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