An overview of device modeling in bridging manufacturing and design for RF applications

Author

Cheng, Yuhua

Author_Institution

Sky works Solutions Inc., Irvine, CA, USA

Volume

2

fYear

2004

fDate

18-21 Oct. 2004

Firstpage

1123

Abstract

CMOS has become a viable option for RF applications and system-on-chip. This paper reviews device modeling in predicting device behavior for RF IC applications. CMOS downsealing is discussed to examine the trend of device scaling and its impact to high frequency performance of devices. Some device behavior in advanced technology nodes is analyzed to be included in advanced device models. RF models to predict DC, AC noise and distortion behavior are desired while additional modeling efforts are required for parasitics such as interconnect and substrate.

Keywords

CMOS integrated circuits; radiofrequency integrated circuits; semiconductor device models; CMOS downsealing; RF applications; device behavior prediction; device modeling; device scaling; system-on-chip; Application specific integrated circuits; CMOS technology; Integrated circuit modeling; Integrated circuit noise; Predictive models; Radio frequency; Radiofrequency integrated circuits; Semiconductor device modeling; System-on-a-chip; Virtual manufacturing;

fLanguage

English

Publisher

ieee

Conference_Titel

Solid-State and Integrated Circuits Technology, 2004. Proceedings. 7th International Conference on

Print_ISBN

0-7803-8511-X

Type

conf

DOI

10.1109/ICSICT.2004.1436712

Filename

1436712