• DocumentCode
    4371
  • Title

    Buried-heterostructure mid-infrared quantum cascade lasers fabricated by non-selective regrowth and chemical polishing

  • Author

    Chang, C.-C. ; Kirch, J.D. ; Buelow, P. ; Boyle, C. ; Kuech, T.F. ; Lindberg, D. ; Earles, T. ; Botez, D. ; Mawst, L.J.

  • Author_Institution
    Univ. of Wisconsin-Madison, Madison, WI, USA
  • Volume
    51
  • Issue
    14
  • fYear
    2015
  • fDate
    7 9 2015
  • Firstpage
    1098
  • Lastpage
    1100
  • Abstract
    A novel fabrication method of buried-heterostructure (BH) mid-infrared quantum cascade lasers (QCLs) by using non-selective regrowth of iron-doped indium phosphide (InP) (Fe:InP), around deeply etched laser ridges, via metal-organic chemical vapour deposition (MOCVD) and planarisation via chemical polishing is reported. Owing to better heat dissipation, the fabricated 4.75 μm emitting QCLs exhibit about three-fold enhancement in maximum output power under continuous-wave operation at room temperature (T = 20°C) compared with that from lasers without the regrown InP. The demonstrated fabrication method provides a more flexible route to realising BH QCLs by removing strict requirements on the etched-ridge sidewall profile, as well as on the physical dimensions of the dielectric mask for the regrowth via MOCVD. The method can be further employed for making large-emitting aperture, closely packed arrays of QCLs, with planarised geometry, for coherent-power scaling.
  • Keywords
    III-V semiconductors; MOCVD; etching; indium compounds; iron; optical fabrication; polishing; quantum cascade lasers; InP:Fe; MOCVD; buried-heterostructure mid-infrared quantum cascade lasers; chemical polishing; continuous-wave operation; deeply etched laser ridges; dielectric mask; etched-ridge sidewall profile; fabrication method; heat dissipation; metal-organic chemical vapour deposition; nonselective regrowth; physical dimensions; planarisation; temperature 20 degC; wavelength 4.75 mum;
  • fLanguage
    English
  • Journal_Title
    Electronics Letters
  • Publisher
    iet
  • ISSN
    0013-5194
  • Type

    jour

  • DOI
    10.1049/el.2015.1094
  • Filename
    7150459