DocumentCode :
437236
Title :
Modular assembly/packaging of multi-substrate microsystems (WIMS Cube) using thermo-magnetically actuated cables
Author :
Ucok, Asli B. ; Giachino, Joseph M. ; Najafi, Khalil
Author_Institution :
Center for Wireless Integrated Microsystems, Michigan Univ., Ann Arbor, MI, USA
fYear :
2005
fDate :
30 Jan.-3 Feb. 2005
Firstpage :
536
Lastpage :
539
Abstract :
The authors report a packaging/assembly approach for wireless integrated microsystems (WIMS) using flexible thermo-magnetically actuated cables. In this assembly approach, substrates of a microsystem are stacked on top of one another inside a cube (WIMS cube). Electrical/fluidic signals are transferred between system dice using rows of integrated flexible parylene cables attached to cube walls, and actuated, row-by-row during assembly, to make pressure contacts to each die. Actuation of these cables is achieved using thermo-magnetic actuation; resistively generated heat softens up the parylene cable, and magnetic actuation plastically deforms the soft cable. Cubes with integrated parylene cables have been fabricated. Thermo-magnetically actuated 1mm × 1.3mm cables have been shown to deflect ∼800μm with two stable positions in a 0.1T magnetic field at a ∼90°C temperature achieved by resistive heating.
Keywords :
actuators; electric connectors; micromechanical devices; modular construction; semiconductor device manufacture; semiconductor device packaging; 0.1 T; electrical signals; fluidic signals; integrated flexible parylene cables; magnetic field; multi-substrate microsystems modular assembly; multi-substrate microsystems modular packaging; resistive heating; thermo-magnetic actuation; thermo-magnetically actuated cables; wireless integrated microsystems; Assembly systems; Cables; Electromechanical systems; Electronics packaging; Heating; Integrated circuit technology; Magnetic fields; Micromechanical devices; Stacking; Temperature;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Micro Electro Mechanical Systems, 2005. MEMS 2005. 18th IEEE International Conference on
ISSN :
1084-6999
Print_ISBN :
0-7803-8732-5
Type :
conf
DOI :
10.1109/MEMSYS.2005.1453985
Filename :
1453985
Link To Document :
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