• DocumentCode
    437236
  • Title

    Modular assembly/packaging of multi-substrate microsystems (WIMS Cube) using thermo-magnetically actuated cables

  • Author

    Ucok, Asli B. ; Giachino, Joseph M. ; Najafi, Khalil

  • Author_Institution
    Center for Wireless Integrated Microsystems, Michigan Univ., Ann Arbor, MI, USA
  • fYear
    2005
  • fDate
    30 Jan.-3 Feb. 2005
  • Firstpage
    536
  • Lastpage
    539
  • Abstract
    The authors report a packaging/assembly approach for wireless integrated microsystems (WIMS) using flexible thermo-magnetically actuated cables. In this assembly approach, substrates of a microsystem are stacked on top of one another inside a cube (WIMS cube). Electrical/fluidic signals are transferred between system dice using rows of integrated flexible parylene cables attached to cube walls, and actuated, row-by-row during assembly, to make pressure contacts to each die. Actuation of these cables is achieved using thermo-magnetic actuation; resistively generated heat softens up the parylene cable, and magnetic actuation plastically deforms the soft cable. Cubes with integrated parylene cables have been fabricated. Thermo-magnetically actuated 1mm × 1.3mm cables have been shown to deflect ∼800μm with two stable positions in a 0.1T magnetic field at a ∼90°C temperature achieved by resistive heating.
  • Keywords
    actuators; electric connectors; micromechanical devices; modular construction; semiconductor device manufacture; semiconductor device packaging; 0.1 T; electrical signals; fluidic signals; integrated flexible parylene cables; magnetic field; multi-substrate microsystems modular assembly; multi-substrate microsystems modular packaging; resistive heating; thermo-magnetic actuation; thermo-magnetically actuated cables; wireless integrated microsystems; Assembly systems; Cables; Electromechanical systems; Electronics packaging; Heating; Integrated circuit technology; Magnetic fields; Micromechanical devices; Stacking; Temperature;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Micro Electro Mechanical Systems, 2005. MEMS 2005. 18th IEEE International Conference on
  • ISSN
    1084-6999
  • Print_ISBN
    0-7803-8732-5
  • Type

    conf

  • DOI
    10.1109/MEMSYS.2005.1453985
  • Filename
    1453985