Title :
Building pixel detector modules in multi chip module deposited technology
Author :
Becks, K.-H. ; Flick, T. ; Grah, C. ; Gerlach, P. ; Mättig, P.
Author_Institution :
Dept. of Phys., Wuppertal Univ., Germany
Abstract :
The MCM-D technique has been used to build hybrid pixel detector modules and single chip assemblies with optimized sensor geometry. Results of test measurements in both a laboratory and a test beam environment are given.
Keywords :
multichip modules; position sensitive particle detectors; semiconductor diodes; silicon radiation detectors; ATLAS semiconductor detector; hybrid pixel detector modules; multichip module deposited technology; sensor geometry; silicon sensor diode; single chip assemblies; test beam; Active matrix technology; Bonding; Detectors; Flip chip; Geometry; Large Hadron Collider; Sensor systems; Testing; Thermal sensors; Thin film sensors;
Conference_Titel :
Nuclear Science Symposium Conference Record, 2004 IEEE
Print_ISBN :
0-7803-8700-7
Electronic_ISBN :
1082-3654
DOI :
10.1109/NSSMIC.2004.1462426
