DocumentCode
438233
Title
Vertical spine electronic device with large room temperature magnetoresistance
Author
Ahmad, E. ; Valavanis, A. ; Xu, Y.E.
Author_Institution
Dept. of Electron., York Univ., UK
fYear
2005
fDate
4-8 April 2005
Firstpage
615
Lastpage
616
Abstract
In this article we report the effect of double Schottky type barriers when a semiconductor layer is sandwiched between two ferromagnetic (FM) layers. A 15 ML of Co with 20 ML of Cr capping layers were deposited on As-adsorbed GaAs(100) substrate. The GaAs(100) substrate has following structure As-capping/GaAs(50 nm, n-type, 1018/cm)/Al0.3Ga0.3As(200 nm, n-type, 1018/cm)/GaAs(100). Optical lithography and selective chemical etching was performed on the thinned sample. A NiFe layer with 10 nm of Cr layer was thermally evaporated and lift-off was performed. As the MR becomes stable beyond the critical current at high fields, its rules put the possibility that the MR could be resulted from Lorentz force. On the contrary, the MR depends on bias current, and as we have a sandwich structure with a SM layer between two FM layers, we could not rule out the possibility that a contribution to this high room temperature MR could come from spin injection and detection through the FM layers.
Keywords
III-V semiconductors; Schottky barriers; aluminium compounds; cobalt; etching; ferromagnetic materials; gallium arsenide; iron alloys; magnetoelectronics; magnetoresistance; nickel alloys; photolithography; semiconductor-metal boundaries; spin polarised transport; vacuum deposition; 293 to 298 K; Co-GaAs-AlGaAs-NiFe; double Schottky type barriers; ferromagnetic layers; lift-off; optical lithography; room temperature magnetoresistance; selective chemical etching; semiconductor layer; spin injection; spintronics; thermal evaporation; vertical spine electronic device; Chemicals; Chromium; Critical current; Etching; Lithography; Lorentz covariance; Magnetoresistance; Sandwich structures; Substrates; Temperature;
fLanguage
English
Publisher
ieee
Conference_Titel
Magnetics Conference, 2005. INTERMAG Asia 2005. Digests of the IEEE International
Print_ISBN
0-7803-9009-1
Type
conf
DOI
10.1109/INTMAG.2005.1463736
Filename
1463736
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