Title :
CoFeB/MgO/CoFeB magnetic tunnel junctions with high TMR ratio and low junction resistance
Author :
Tsunekawa, K. ; Nagai, M. ; Maehara, H. ; Yamagata, S. ; Djayaprawira, D.D. ; Watanabe, N. ; Yuasa, S. ; Suzuki, Y. ; Ando, K.
Author_Institution :
ANELVA Corp., Tokyo, Japan
Abstract :
A successful attempt in obtaining magnetic tunnel junctions (MTJs) with resistance-area (RA) of 4.7 Ωm2 and magneto-resistance (MR) ratio of about 150% at room temperature is reported, in MTJs using CoFeB/MgO/CoFeB. The MTJs consisting of Ta/CuN/Ta/Pt50Mn50/Co70Fe30/Ru/Co60Fe20B20/MgO (x nm)/Co60Fe20B20/Ta/Cu/Ta/Ru were prepared on a thermally oxidized silicon wafer using an ANELVA C-7100 sputtering system. All the metallic films were deposited by using dc magnetron method. The insulating MgO layer was deposited by rf sputtering directly from a sintered MgO target, and the thickness was varied from 6 to 24 Å. After the film deposition, the MTJs were annealed at 360°C for 2 hours in a magnetic field of 8 kOe. It was found that as MgO thickness decreases, RA decreases exponentially, but MR ratio remains constant of about 230% until around 12 Å and gradually decreases for MgO thickness below 12 Å.
Keywords :
annealing; boron alloys; cobalt alloys; copper; copper compounds; insulating thin films; iron alloys; magnesium compounds; manganese alloys; metallic thin films; platinum alloys; ruthenium; sintering; sputter deposition; tantalum; tunnelling magnetoresistance; 2 hour; 293 to 298 K; 360 degC; 6 to 24 angstrom; ANELVA C-7100 sputtering system; CoFeB/MgO/CoFeB magnetic tunnel junctions; Si; TMR ratio; Ta-CuN-Ta-Pt50Mn50-Co70Fe30-Ru-Co60Fe20B20-MgOCo60Fe20B20-Ta-Cu-Ta-Ru; annealing; dc magnetron method; junction resistance; magnetoresistance ratio; metallic films; resistance-area; rf sputtering; sintered MgO target; thermally oxidized silicon wafer; Amorphous magnetic materials; Amorphous materials; Crystallization; Gas insulation; Magnetic fields; Magnetic sensors; Magnetic tunneling; Silicon; Sputtering; Temperature sensors;
Conference_Titel :
Magnetics Conference, 2005. INTERMAG Asia 2005. Digests of the IEEE International
Print_ISBN :
0-7803-9009-1
DOI :
10.1109/INTMAG.2005.1464041