DocumentCode
438373
Title
Design at the end of the silicon roadmap
Author
Rabaey, Jan M. ; Pederson, Donald O.
Author_Institution
Gigascale Syst. Res. Center, California Univ., Berkeley, CA, USA
Volume
1
fYear
2005
fDate
18-21 Jan. 2005
Abstract
Scaling of silicon integrated technology into the deep sub-100 nm space brings with it a number of formidable challenges to the designer. Issues such as design complexity, power dissipation, process variability and reliability are challenging the traditional design methodologies. In this presentation, it is conjectured that the only viable long-term solution to these challenges is to drastically revise the way we do design, and a road map of potential solutions is presented. Ultimately, these innovative design solutions will help to pave the way to the post-silicon era.
Keywords
elemental semiconductors; integrated circuit design; integrated circuit reliability; silicon; design complexity; design methodology; innovative design solutions; power dissipation; process variability; silicon integrated technology; silicon roadmap; Design methodology; Power dissipation; Power system reliability; Silicon; Space technology;
fLanguage
English
Publisher
ieee
Conference_Titel
Design Automation Conference, 2005. Proceedings of the ASP-DAC 2005. Asia and South Pacific
Print_ISBN
0-7803-8736-8
Type
conf
DOI
10.1109/ASPDAC.2005.1466099
Filename
1466099
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